TSMC Set to Launch Smaller Substrate FOPLP Production by 2026
Chip manufacturing leader TSMC has decided to choose smaller substrates for its initial FOPLP (panel-level fan-out packaging) production. According to reports, a small-scale production line is expected to start by 2026.
Selection of 300×300 mm Substrate
TSMC had earlier considered 515×510 mm and 600×600 mm substrate sizes, but ultimately preferred the 300×300 mm size considering cost and equipment capacity. This size is equivalent to a 12-inch wafer, but its square corners provide more stability and reduce production costs.
Technical Challenges and Solutions
FOPLP technology is still in the development stage. The problem of bending of edges of large substrates and damage during transportation remains. Therefore, TSMC has adopted a strategy of “starting easy, progressing towards difficulty”. As the technology improves, larger-sized substrates will be used.
Production and Equipment Development
TSMC confirmed in its July 2024 earnings call that the company is working on a mini production line for FOPLP. Research and development on this technology is being carried out rapidly in collaboration with equipment manufacturers. Initial production will begin by 2026 and is planned to be scaled up by 2027.
Progress of Other Companies
Apart from TSMC, Samsung and Intel are also making rapid progress in advanced packaging technologies. Samsung is active in technologies such as I-Cube 2.5D, X-Cube 3D IC packaging. At the same time, Intel is preparing to launch glass substrate-based packaging solutions between 2026 and 2030.
Impact of Increasing Demand for AI Chips
The need for advanced packaging technologies is increasing due to the increase in global demand for AI chips. TSMC introduced FOWLP (fan-out wafer-level packaging) technology for the iPhone 7’s A10 processor in 2016. Now FOWLP solutions are proving to be more cost-efficient, leading to increased customer interest.
This initiative by TSMC is a significant step for tech enthusiasts and the industry, which will set new benchmarks towards advanced chip manufacturing.
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